TL21W02-N Datasheet, PDF (8/14 Pages) Toshiba Semiconductor – LED lamps

10.2. Soldering
Following show examples of reflow soldering.
• Temperature Profile (see following figures.)
TL21W02-N(T34
Fig. 10.2.1 Temperature Profile for Pb Soldering Fig. 10.2.2 Temperature profile for Lead(Pb)-free
(example)
soldering (example)
• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed
the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering
under the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 168
hours of opening the package.
• If a second reflow process is necessary, reflow soldering should be performed within 168 h of the first
reflow under the above conditions. Storage conditions before the second reflow soldering: 30, 60% RH
(max)
• Do not perform wave soldering.
10.3. Land Pattern Dimensions for Reference Only
Fig. 10.3.1 Land Pattern Dimensions for Reference Only (Unit: mm)
8
2011-10-20
Rev.1.0