TORX198 Datasheet, PDF (7/8 Pages) Toshiba Semiconductor – FIBER OPTIC RECEIVING MODULE

TORX198
(11) Soldering condition
Solder at 260°C or less for no more than three seconds.
(12) Precautions when disposing of devices and packing materials.
When disposing devices and packing materials, follow the procedures stipulated by local regulations
in order to protect the environment against contamination.
When devices are disposed of, worker safety and protection of the environment must be taken into
account.
(13) Precautions during use
Toshiba is continually working to improve the quality and the reliability of their products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical
sensitivity and their vulnerability to physical stress. It is the responsibility of the buyer, when
utilizing Toshiba products, to observe standards of safety, and to avoid situations in which the
malfunction or failure of a Toshiba product could cause loss of human life, bodily injury or damage to
property.
When developing equipment, please ensure that Toshiba products are used within the specified
operating ranges set forth in the most recent product specifications. Also, please keep in mind the
precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook.
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2001-08-10