TLBC1002 Datasheet, PDF (7/11 Pages) Toshiba Semiconductor – Panel Circuit Indicator

TL(BC,EGC)1002(T02)
• Reflow soldering (example)
Temperature profile for Pb-free soldering (example)
5 s max_(*)
260°C max^(*)
4°C/s max(*)
(*)
150~180°C max 230°C
4°C/s max^(*)
(*)
60~120 s max
30~50 s max^(*)
Time (s)
• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 72 h of
opening the package.
• Second reflow soldering
In case of second reflow soldering should be performed within 72 h of the first reflow under the above conditions.
Storage conditions before the second reflow soldering: 30°C, 70% RH (max)
• Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: 25 W
Temperature : 300°C or less
Time
: within 3 s
• Do not perform wave soldering.
Recommended soldering pattern
1.2 1.0 1.2
Unit: mm
(1.2)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES
KAO CLEAN TROUGH 750H
PINE ALPHA ST-100S
TOSHIBA TECHNOCARE
(FRW-17, FRW-1, FRV-100)
: (made by ASAHI GLASS)
: (made by KAO)
: (made by ARAKAWA CHEMICAL)
: (made by GE TOSHIBA SILICONES)
Precaution when mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic, do not apply friction using a hard material.
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
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2007-10-01