TL12W02-N Datasheet, PDF (6/10 Pages) Toshiba Semiconductor – LED lamps

Recommended soldering pattern
7.4
3.3
単位(mm)
Unit (mm)
3.4
0.8
TL12W02-N(T30)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES: (made by ASAHI GLASS)
Precautions when Mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic, do not apply friction using a hard material.
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The method of
classification is as below. (this method, however does not apply to products whose electrical characteristics
differ from standard Toshiba specifications)
(1) Tape Type: T30 (8-mm pitch)
(2) Example
TL12W02-N (T30)
Tape type
Toshiba product No.
2. Handling precautions
Tape material protected against static electricity. However, static electricity may occur depending on quantity
of charged static electricity and a device may attach to a tape, or a device may be unstable when peeling a tape
cover.
(a) Since tape materials may accumulate an electrostatic charge, use an ionizer to neutralize the ambient air.
(b) For transport and temporary storage of devices, use containers (boxes and bags) and jigs that are made of
anti-static materials or of materials which dissipate electrostatic charge.
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2009-01-19