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SSM6L11TU Datasheet, PDF (3/9 Pages) Toshiba Semiconductor – High Speed Switching Applications | |||
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SSM6L11TU
Q2 Electrical Characteristics (Ta = 25°C)
Characteristics
Gate leakage current
Drain-Source breakdown voltage
Drain cut-off current
Gate threshold voltage
Forward transfer admittance
Drain-Source on-resistance
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time
Turn-on time
Turn-off time
Note3: Pulse test
Symbol
Test Condition
Min Typ. Max Unit
IGSS
VGS = ± ï 12V, VDS = 0
â¯
â¯
±1
μA
V (BR) DSS
V (BR) DSX
ID = -1 mA, VGS = 0
ID = -1 mA, VGS = +12 V
-20
â¯
â¯
V
-8
â¯
â¯
IDSS
VDS = -20 V, VGS = 0
â¯
â¯
-1
μA
Vth
VDS = -3 V, ID = -0.1 mA
-0.5
â¯
-1.1
V
âYfsâ
VDS = -3 V, ID = -0.25 A
(Note3) 0.65 1.3
â¯
S
RDS (ON)
ID = -0.25 A, VGS = -4 V
ID = -0.25 A, VGS = -2.5 V
(Note3) â¯
(Note3) â¯
210 260
mΩ
310 430
Ciss
VDS = -10 V, VGS = 0, f = 1 MHz
⯠218 â¯
pF
Crss
VDS = -10 V, VGS = 0, f = 1 MHz
â¯
42
â¯
pF
Coss
VDS = -10 V, VGS = 0, f = 1 MHz
â¯
52
â¯
pF
ton
VDD = -10 V, ID = -0.25 A,
toff
VGS = 0~-2.5 V, RG = 4.7 Ω
â¯
16
â¯
ns
â¯
15
â¯
Switching Time Test Circuit
(a) Test circuit
0
IN
â2.5V
10 μs
VDD = -10 V
RG = 4.7 Ω
D.U. <= 1%
VIN: tr, tf < 5 ns
Common Source
Ta = 25°C
OUT
RL
VDD
(b) VIN
0V
(c) VOUT
â2.5 V
VDS (ON)
VDD
10%
90%
90%
10%
tr
tf
ton
toff
Precaution
Vth can be expressed as the voltage between gate and source when the low operating current value is ID=-100 μA for
this product. For normal switching operation, VGS (on) requires a higher voltage than Vth and VGS (off) requires a lower
voltage than Vth.
(The relationship can be established as follows: VGS (off) < Vth < VGS (on))
Please take this into consideration when using the device.
.
3
2007-11-01
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