CRS03_06 Datasheet, PDF (3/5 Pages) Toshiba Semiconductor – Switching Mode Power Supply Applications

i_F – v_F
10
Tj = 150°C
1
125°C
75°C
25°C
0.1
0.01
0
0.2
0.4
0.6
0.8
1.0
1.2
Instantaneous forward voltage VF (V)
Ta max – I_{F (AV)}
Ceramic substrate (substrate size: 50 mm × 50 mm)
160
140
120
100
α = 60°
80
Rectangular
waveform
60
120°
180°
DC
40 _{0° α 360°}
IF _(AV)
20 Conduction
angle α
VR = 15 V
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average forward current I_{F (AV)} (A)
CRS03
P_{F (AV)} – I_{F (AV)}
0.6
0.5
0.4
0.3
α = 60°
0.2
DC
180°
120°
Rectangular
waveform
0.1
0° α 360°
Conduction angle α
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average forward current I_{F (AV)} (A)
Ta max – IF (AV)
Glass-epoxy substrate (substrate size:
50 mm × 50 mm, soldering land: 6 mm × 6 mm)
160
Rectangular waveform
140
IF _(AV)
120
0° α 360°
VR = 15 V
100
Conduction angle α
80
60
40
α = 60° 120°
180° DC
20
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Number of cycles
Tℓ max – I_{F (AV)}
160
140
120
100
α = 60° 120°
180° DC
80 _Rectangular
waveform
60
40 _{0° α 360°}
20 ConductioInF ^(AV)
angle α
VR = 15 V
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average forward current I_{F (AV)} (A)
r_{th (j-a)} – t
10000
① Device mounted on a ceramic board:
Soldering land: 2 mm × 2 mm
② Device mounted on a glass-epoxy board:
1000 Soldering land: 6 mm × 6 mm
100
②
①
10
1
0.001
0.01
0.1
1
Time t (s)
10
100
3
2006-11-13