CRS02_06 Datasheet, PDF (3/5 Pages) Toshiba Semiconductor – Switching Mode Power Supply Applications

i_F – v_F
10
Tj = 125°C
1
75°C
25°C
0.1
0.01
0
0.2
0.4
0.6
0.8
1.0
1.2
Instantaneous forward voltage VF (V)
Ta max – I_{F (AV)}
Ceramic substrate (substrate size: 50 mm × 50 mm)
140
120
100
80
α = 60°
60 _Rectangular
waveform
40
120°
180°
DC
0° α 360°
20 _{ConductionIF (AV)}
0 ^{angle α VR = 15 V}
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average forward current I_{F (AV)} (A)
CRS02
P_{F (AV)} – I_{F (AV)}
0.7
0.6
DC
0.5
180°
120°
0.4
α = 60°
0.3
0.2
Rectangular
waveform
0.1
0° α 360°
Conduction angle α
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average forward current I_{F (AV)} (A)
Ta max – I_{F (AV)}
Glass-epoxy substrate (substrate size:
50 mm × 50 mm, soldering land: 6 mm × 6 mm)
140
Rectangular
waveform
120
IF _(AV)
100
0° α 360°
Conduction angle α
80
VR = 15 V
60
40
20 _{α = 60°} 120°
180°
DC
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average forward current I_{F (AV)} (A)
Tℓ max – I_{F (AV)}
140
120
100
80
α = 60°
Rectangular
60 waveform
120°
DC
180°
40
0° α 360°
20
IF _(AV)
Conduction
angle α
VR = 15 V
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average forward current I_{F (AV)} (A)
r_{th (j-a)} – t
10000
① Device mounted on a ceramic board:
Soldering land: 2 mm × 2 mm
② Device mounted on a glass-epoxy board:
1000 soldering land: 6 mm × 6 mm
100
②
①
10
1
0.001
0.01
0.1
1
Time t (s)
10
100
3
2006-11-13