CMF02 Datasheet, PDF (3/4 Pages) Toshiba Semiconductor – Switching Mode Power Supply Applications

CMF02
10
Pulse test
i_F – v_F
Tj = 150°C
1
75°C
0.1
25°C
0.01
0
1.0
2.0
3.0
4.0
5.0
Instantaneous forward voltage VF (V)
Ta max – I_{F (AV)}
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm, land size: 6 mm × 6 mm)
160
140
120
100
80
Rectangular
60
waveform
40
120°
0° α 360°
20
α = 60°
180°
Conduction
angle: α
0
0
0.2
0.4
0.6
0.8
1.0
1.2
Average forward current I_{F (AV)} (A)
P_{F (AV)} – I_{F (AV)}
3.0
180°
2.0
120°
α = 60°
Rectangular
waveform
1.0
0° α 360°
Conduction angle α
0
0
0.2
0.4
0.6
0.8
1.0
1.2
Average forward current I_{F (AV)} (A)
Tℓ max – I_{F (AV)}
160
140
120
100
80
60
Rectangular
waveform
40
0° α 360°
20
Conduction
angle: α
0
0
0.2
0.4
α = 60° 120° 180°
0.6
0.8
1.0
1.2
Average forward current I_{F (AV)} (A)
Surge forward current
(non-repetitive)
12
Ta = 25°C
f = 50 Hz
10
8
6
4
2
0
1
35
10
30 50 100
Number of cycles
r_{th (j-a)} – t
1000 _{Device mounted on}
a glass-epoxy board
(board size: 50 mm × 50 mm,
land size: 2.1 mm × 1.4 mm,
board thickness: 1.6 t)
100
10
1
0.001
Device mounted on
a glass-epoxy board
(board size: 50 mm × 50 mm,
land size: 6 mm × 6 mm,
board thickness: 1.6 t)
Device mounted on a ceramic board
(board size: 50 mm × 50 mm,
land size: 2 mm × 2 mm,
board thickness: 0.64 t)
0.01
0.1
1
10
100 1000
Time t (s)
3
2007-04-16