TMP88FW44FG Datasheet, PDF (278/282 Pages) Toshiba Semiconductor – 8 Bit Microcontroller

22. Electrical Characteristics
22.8 Handling Precaution
22.7 Recommended Oscillating Conditions
XIN
XOUT
XTIN
XTOUT
TMP88FW44FG
C₁
C₂
C₁
C₂
(1) High-frequency Oscillation
(2) Low-frequency Oscillation
Note 1: To ensure stable oscillation, the resonator position, load capacitance, etc. must be appropriate. Because these factors are
greatly affected by board patterns, please be sure to evaluate operation on the board on which the device will actually be
mounted.
Note 2: The product numbers and specifications of the resonators by Murata Manufacturing Co., Ltd. are subject to change. For
up-to-date information, please refer to the following URL:
http://www.murata.com
22.8 Handling Precaution
- The solderability test conditions for lead-free products (indicated by the suffix G in product name) are shown
below.
1. When using the Sn-37Pb solder bath
Solder bath temperature = 230 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
2. When using the Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature = 245 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
Note: The pass criteron of the above test is as follows:
Solderability rate until forming ≥ 95 %
- When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we recommend elec-
trically shielding the package in order to maintain normal operating condition.
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