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TLP3212 Datasheet, PDF (2/7 Pages) Toshiba Semiconductor – PHOTOCOUPLER PHOTO RELAY
Absolute Maximum Ratings (Ta = 25°C)
TLP3212
CHARACTERISTIC
SYMBOL
RATING
UNIT
Forward Current
Forward Current Derating (Ta ≥ 25°C)
Reverse Voltage
Junction Temperature
Off-State Output Terminal Voltage
On-State Current
On-State Current Derating (Ta ≥ 25°C)
Junction Temperature
Storage Temperature Range
Operating Temperature Range
Lead Soldering Temperature (10 s)
Isolation Voltage (AC, 1 minute, R.H. ≤ 60%) (Note 1)
IF
ΔIF/°C
VR
Tj
VOFF
ION
ΔION/°C
Tj
Tstg
Topr
Tsol
BVS
50
−0.5
5
125
60
400
−4.0
125
−40 to 125
−20 to 85
260
1500
mA
mA/°C
V
°C
V
mA
mA/°C
°C
°C
°C
°C
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note1: Device considered a two-terminal device : Pins 1 and, 2 shorted together, and pins 3 and 4 shorted together.
Caution
This device is sensitive to electrostatic discharge. When using this device, please ensure that all tools and
equipment are earthed.
This device is applying super small package which is free for Moisture-Proof packing. However, the application of
this device is premised on use under controlled environmental condition like as measuring instrument. It is
necessary to take precautions of storage condition and operating environmental condition.
Recommended Operating Conditions
CHARACTERISTIC
SYMBOL MIN. TYP. MAX. UNIT
Supply Voltage
VDD
⎯
⎯
48
V
Forward Current
IF
⎯
⎯
20
mA
On-State Current
ION
⎯
⎯ 400 mA
Operating Temperature
Topr
−20
⎯
65
°C
Note: Recommended operating conditions are given as a design guideline to
obtain expected performance of the devices. Each item also has its own
independent guideline document. In developing designs using these
products, please confirm the specified characteristics shown in these
documents.
2
2008-04-01