TLP3119 Datasheet, PDF (2/6 Pages) Toshiba Semiconductor – TOSHIBA PHOTOCOUPLER PHOTO RELAY

TLP3119
Absolute Maximum Ratings (Ta = 25°C)
CHARACTERISTIC
SYMBOL
RATING
UNIT
Forward Current
Forward Current Derating (Ta ≥ 25°C)
Reverse Voltage
Junction Temperature
Off-State Output Terminal Voltage
On-State Current
On-State Current Derating (Ta ≥ 25°C)
Junction Temperature
Storage Temperature Range
Operating Temperature Range
Lead Soldering Temperature (10 s)
Isolation Voltage (AC, 1 minute, R.H. ≤ (60%) (Note 1)
I_F
ΔI_F/°C
V_R
T_j
V_OFF
I_ON
ΔI_ON/°C
T_j
T_stg
T_opr
T_sol
BV_S
50
−0.5
5
125
80
200
−2.0
125
−40 to 125
−20 to 85
260
1500
mA
mA/°C
V
°C
V
mA
mA/°C
°C
°C
°C
°C
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two-terminal device: Pins 1 and, 2 shorted together, and pins 3 and 4 shorted together.
Caution
This device is sensitive to electrostatic discharge. When using this device, please ensure that all tools and
equipment are earthed.
Recommended Operating Conditions
CHARACTERISTIC
SYMBOL MIN TYP. MAX UNIT
Supply Voltage
Forward Current
On-State Current
Operating Temperature
V_DD
I_F
I_ON
T_opr
⎯
⎯
64
V
5
⎯
30
mA
⎯
⎯ 200 mA
25
⎯
60
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
2
2008-07-01