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TLP3020 Datasheet, PDF (2/6 Pages) Toshiba Semiconductor – TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRIAC
TLP3020, TLP3021, TLP3022, TLP3023
Absolute Maximum Ratings (Ta=25°C)
CHARACTERISTIC
SYMBOL
RATING
UNIT
Forward Current
Forward Current Derating
(Ta ≥ 53°C)
Peak Forward Current
(100μs pulse, 100pps)
Power Dissipation
Power Dissipation Derating
(Ta ≥ 25°C)
Reverse Voltage
Junction Temperature
Off-State Output Terminal Voltage
On-Stage RMS Ta=25°C
Current
Ta=70°C
On-State Current Derating
(Ta ≥ 25°C)
Peak On-Stage Current
(100μs pulse, 120pps)
Peak Nonrepetitive Surge
Current (PW=10ms, DC=10%)
Power Dissipation
Power Dissipation Derating
(Ta ≥ 25°C)
Junction Temperature
Storage Temperature Range
Operating Temperature Range
Lead Soldering Temperature (10s)
Total Package Power Dissipation
Total Package Power Dissipation
Derating (Ta ≥ 25°C)
Isolation Voltage
(AC, 1 min., R.H. ≤ 60%) (Note 1)
IF
ΔIF/°C
IFP
PD
ΔPD/°C
VR
Tj
VDRM
IT(RMS)
ΔIT/°C
ITP
ITSM
PD
ΔPD/°C
Tj
Tstg
Topr
Tsol
PT
ΔPT/°C
BVS
50
−0.7
1
100
−1.0
5
125
400
100
50
−1.1
2
1.2
300
−4.0
115
−55 ∼ 150
−40 ∼ 100
260
330
−4.4
5000
mA
mA/°C
A
mW
mW/°C
V
°C
V
mA
mA/°C
A
A
mW
mW/°C
°C
°C
°C
°C
mW
mW/°C
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two terminal device: Pins 1, 2 and 3 shorted together and pins 4 and 6 shorted
together.
2
2007-10-01