TLP227G_07 Datasheet, PDF (2/6 Pages) Toshiba Semiconductor – Photo Relay

Internal Circuit
(TLP227G)
1
4
TLP227G,TLP227G−2
2
3
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Forward current
I_F
50
mA
Forward current derating(Ta ≥ 25°C)
ΔI_F / °C
−0.5
mA / °C
Peak forward current(100μs pulse, 100pps)
I_FP
1
A
Reverse voltage
V_R
5
V
Junction temperature
T_j
125
°C
Off-state output terminal voltage
V_OFF
350
V
TLP227G
120
On-state current
TLP227G−2
One channel
I_ON
120
mA
Both channel (Note 1)
100
TLP227G
−1.2
On-state current
derating(Ta ≥ 25°C)
TLP227G−2
One channel
ΔI_ON / °C
−1.2
mA / °C
Both channel (Note 1)
−1.0
Junction temperature
Storage temperature range
Operating temperature range
T_j
125
°C
T_stg
−55~125
°C
T_opr
−40~85
°C
Lead soldering temperature (10 s)
T_sol
260
°C
Isolation voltage (AC,1 min., R.H.≤ 60%)
(Note 2)
BV_S
2500
V_rms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 1): Two channels operating simultaneously.
(Note 2): Device considered a two-terminal device: LED side pins shorted together, and detector side pins shorted
together.
Recommended Operating Conditions
Characteristic
Symbol
Min. Typ. Max. Unit
Supply voltage
Forward current
On-state current
Operating temperature
V_DD
I_F
I_ON
T_opr
―
―
280
V
5
7.5
25
mA
―
― 100 mA
−20
―
65
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
2
2007-10-01