TLP220A Datasheet, PDF (2/8 Pages) Toshiba Semiconductor – Photocouplers Photorelay

5. Internal Circuit
TLP220A
Fig. 5.1 Internal Circuit
6. Mechanical Parameters
Characteristics
Creepage distances
Clearance distances
Internal isolation thickness
7.62-mm Pitch
TLP220A
7.0 (min)
7.0 (min)
0.4 (min)
10.16-mm Pitch
TLP220AF
Unit
8.0 (min)
mm
8.0 (min)
0.4 (min)
7. Absolute Maximum Ratings (Note) (Unless otherwise specified, T_a = 25)
Characteristics
Symbol Note
Rating
Unit
LED Input forward current
I_F
30
mA
Input forward current derating
Input forward current (pulsed)
(T_a ≥ 25)
(100 µs pulse, 100 pps)
∆I_F/∆T_a
I_FP
-0.3
mA/
1
A
Input reverse voltage
V_R
5
V
Input power dissipation
Junction temperature
P_D
50
mW
T_j
125

Detector OFF-state output terminal voltage
V_OFF
60
V
ON-state current
ON-state current derating
(T_a ≥ 25)
I_ON
∆I_ON/∆T_a
500
mA
-5
mA/
ON-state current (pulsed)
(t = 100 ms, Duty = 1/10)
I_ONP
1.5
A
Output power dissipation
Junction temperature
P_O
500
mW
T_j
125

Common Storage temperature
T_stg
-55 to 125
Operating temperature
Lead soldering temperature
T_opr
(10 s)
T_sol
-40 to 85
260
Isolation voltage
AC, 1 min, R.H. ≤ 60%
BV_S (Note 1)
5000
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are
shorted together.
2
2013-02-05
Rev.3.0