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SSM3K04FE Datasheet, PDF (2/5 Pages) Toshiba Semiconductor – High Speed Switching Applications
SSM3K04FE
Electrical Characteristics (Ta = 25°C)
Characteristics
Gate leakage current
Drain-source breakdown voltage
Drain cut-off current
Gate threshold voltage
Forward transfer admittance
Drain-source ON resistance
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time
Turn-on time
Turn-off time
Gate-source resistor
Symbol
Test Condition
Min Typ. Max Unit
IGSS
VGS = 10 V, VDS = 0
¾
¾
15
mA
V (BR) DSS ID = 100 mA, VGS = 0
20
¾
¾
V
IDSS
VDS = 20 V, VGS = 0
¾
¾
1
mA
Vth
VDS = 3 V, ID = 0.1 mA
0.7
¾
1.3
V
ïYfsï
VDS = 3 V, ID = 10 mA
25
50
¾
mS
RDS (ON) ID = 10 mA, VGS = 2.5 V
¾
4
12
W
Ciss
VDS = 3 V, VGS = 0, f = 1 MHz
¾ 11.0 ¾
pF
Crss
VDS = 3 V, VGS = 0, f = 1 MHz
¾
3.3
¾
pF
Coss
VDS = 3 V, VGS = 0, f = 1 MHz
¾
9.3
¾
pF
ton
VDD = 3 V, ID = 10 mA, VGS = 0~2.5 V
¾
0.16
¾
ms
toff
VDD = 3 V, ID = 10 mA, VGS = 0~2.5 V
¾
0.19
¾
RGS
VGS = 0~10 V
0.7
1.0
1.3
MW
Switching Time Test Circuit
(a) Test circuit
(b) VIN
VGS
(c) VOUT
VDS
2
2003-03-27