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SSM3K03FV Datasheet, PDF (2/5 Pages) Toshiba Semiconductor – High Speed Switching Applications
SSM3K03FV
Electrical Characteristics (Ta = 25°C)
Characteristics
Gate leakage current
Drain-source breakdown voltage
Drain cut-off current
Gate threshold voltage
Forward transfer admittance
Drain-Source on-resistance
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time
Turn-on time
Turn-off time
Symbol
Test Condition
Min Typ. Max Unit
IGSS
VGS = 10 V, VDS = 0
⎯
⎯
1
μA
V (BR) DSS ID = 100 μA, VGS = 0
20
⎯
⎯
V
IDSS
VDS = 20 V, VGS = 0
⎯
⎯
1
μA
Vth
VDS = 3 V, ID = 0.1 mA
0.7
⎯
1.3
V
⎪Yfs⎪
VDS = 3 V, ID = 10 mA
25
50
⎯
mS
RDS (ON) ID = 10 mA, VGS = 2.5 V
⎯
4
12
Ω
Ciss
VDS = 3 V, VGS = 0, f = 1 MHz
⎯ 11.0 ⎯
pF
Crss
VDS = 3 V, VGS = 0, f = 1 MHz
⎯
3.3
⎯
pF
Coss
VDS = 3 V, VGS = 0, f = 1 MHz
⎯
9.3
⎯
pF
ton
VDD = 3 V, ID = 10 mA, VGS = 0~2.5 V
⎯
0.16
⎯
μs
toff
VDD = 3 V, ID = 10 mA, VGS = 0~2.5 V
⎯
0.19
⎯
Switching Time Test Circuit
(a) Test circuit
(b) VIN
VGS
(c) VOUT
VDS
Precaution
Vth can be expressed as the voltage between gate and source when the low operating current value is ID = 100 μA for
this product. For normal switching operation, VGS (on) requires a higher voltage than Vth and VGS (off) requires a lower
voltage than Vth.
(The relationship can be established as follows: VGS (off) < Vth < VGS (on))
Take this into consideration when using the device.)
2
2007-11-01