CMF03 Datasheet, PDF (2/4 Pages) Toshiba Semiconductor – Switching Mode Power Supply Applications

Electrical Characteristics (Ta = 25°C)
Characteristic
Peak forward voltage
Repetitive peak reverse current
Reverse recovery time
Forward recovery time
Thermal resistance
Thermal resistance (junction to lead)
Symbol
V_FM
I_RRM
trr
tfr
R_{th (j-a)}
R_{th (j-ℓ)}
Test Condition
I_FM = 0.5 A (pulse test)
V_RRM = 900 V (pulse test)
I_F = 1 A, di/dt ＝-30 A/μs
I_F = 1 A
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 t)
⎯
CMF03
Min Typ. Max Unit
⎯
⎯
2.5
V
⎯
⎯
50
μA
⎯
⎯
100
ns
⎯ 550 ⎯
ns
⎯
⎯
60
⎯
⎯
135 _°C/W
⎯
⎯
210
⎯
⎯
16 °C/W
Marking
Abbreviation Code
F3
Part No.
CMF03
Standard Soldering Pad
Unit: mm
1.4
3.0
1.4
Handling Precautions
Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When
using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance
value.
Refer to the Rectifier databook for further information.
2
2007-04-09