CMF01 Datasheet, PDF (2/4 Pages) Toshiba Semiconductor – Switching Mode Power Supply Applications

Electrical Characteristics (Ta = 25°C)
Characteristic
Peak forward voltage
Repetitive peak reverse current
Reverse recovery time
Forward recovery time
Thermal resistance
Thermal resistance (junction to lead)
Symbol
V_FM
I_RRM
trr
tfr
R_{th (j-a)}
R_{th (j-ℓ)}
Test Condition
I_FM = 2.0 A (pulse test)
V_RRM = 600 V (pulse test)
I_F = 1 A, di/dt ＝-30 A/μs
I_F = 1 A
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 t)
⎯
CMF01
Min Typ. Max Unit
⎯
1.4 2.0
V
⎯
⎯
50
μA
⎯
⎯
100
ns
⎯ 270 ⎯
ns
⎯
⎯
60
⎯
⎯
135 _°C/W
⎯
⎯
210
⎯
⎯
16 °C/W
Marking
Abbreviation Code
F1
Part No.
CMF01
Standard Soldering Pad
Unit: mm
1.4
3.0
1.4
Handling Precautions
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded
during operation, even for an instant. The following are the general derating methods we recommend for designing a
circuit using this device.
V_RRM: We recommend that the worst-case voltage, including surge voltage, be no greater than 80% of the absolute
maximum rating of V_RRM for a DC circuit; and no greater than 50% of that of V_RRM for an AC circuit.
V_RRM has a temperature coefficient (0.1%/℃). Be sure to take this temperature coefficient into account when
designing a device for use at low temperature.
I_F(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of I_F(AV).
Carry out sufficient heat design. If it is not possible to design a circuit with excellent heat radiation, set a margin by
using an allowable Tamax-IF (AV) curve.
This rating specifies the non-repetitive peak current in one cycle of a 50 Hz sine wave, condition angle 180°. Therefore
the rating applies only to abnormal operation, which seldom occurs during the lifespan of a device.
For this device, we recommend a Tj of below 120℃ under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When
using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance
value.
Refer to the Rectifier databook for further information.
2
2006-11-07