TPS859 Datasheet, PDF (1/13 Pages) Toshiba Semiconductor – TOSHIBA Photo IC Silicon Epitaxial Planar

TOSHIBA Photo IC Silicon Epitaxial Planar
TPS859
TPS859
○ Flat Panel Displays
○ Mobile Phones
○ Notebook PCs, PDAs
○ Video cameras, Digital Still Cameras
○ Other Equipment Requiring Luminosity Adjustment
The TPS859 is an ultra-compact surface-mount photo-IC for
illuminance sensors which incorporates a photodiode and current amp
circuit in a single chip.The sensitivity is superior to that of a
phototransistor, and exhibits little variation.
It has spectral sensitivity closer to luminous efficiency and excellent
output linearity.
With its ultra-compact surface-mount package, this photo-IC can be
used as the power-saving control for domestic appliances or for
backlighting for displays in cellular phones, this device enables low
power consumption to be achieved.
• Ultra-compact and light surface-mount package
: 1.6 mm× 1.6 mm × 0.55 mm
• Excellent output linearity of illuminance
• Little fluctuation in light current and high level of sensitivity
: IL = 230 μA (typ.) @EV = 100 lx using fluorescent light
TOSHIBA
0-2E1B
: Light current variation width: × 1.67 ( When light current
classification is specified.)
Weight: 0.003 g (typ.)
: Little temperature fluctuation
• Built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources
: I_L (using incandescent light)/I_L (using fluorescent light) = 1.0 (typ.)
• Low supply voltage, making device suitable for battery-powered equipment: V_CC = 1.8 V to 5.5 V^Absolute
Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Supply voltage
V_CC
−0.5 to 6
V
Output voltage
V_OUT
≤ V_CC
V
Light current
I_L
4
mA
Permissible power dissipation
P
30
mW
Power dissipation derating (Ta > 25°C)
ΔP/°C
−0.4
mW/°C
Operating temperature range
T_opr
−30 to 85
°C
Storage temperature range
T_stg
−40 to 100
°C
Soldering temperature range (Note 1)
T_sol
260
°C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling
Precautions.
1
2008-05-13