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TPS853 Datasheet, PDF (1/12 Pages) Toshiba Semiconductor – TOSHIBA Photo IC Silicon Epitaxial Planar | |||
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TOSHIBA Photo IC Silicon Epitaxial Planar
TPS853
Mobile Phones, PHS
Notebook PCs, PDAs
Video cameras, Digital Still Cameras
Other Equipment Requiring Luminosity Adjustment
TPS853
The TPS853 is an ultra-compact surface-mount photo-IC for
illuminance sensors which incorporates a photodiode and current amp
circuit in a single chip.
The sensitivity is superior to that of a phototransistor, and exhibits
little variation.
It has spectral sensitivity closer to luminous efficiency and excellent
output linearity.
With its ultra-compact surface-mount package, this photo-IC can be
used as the power-saving control for domestic appliances or for
backlighting for displays in cellular phones, this device enables low
power consumption to be achieved.
⢠Ultra-compact and light surface-mount package suitable for lead-free
soldering and reflow soldering: 2.0 Ã 2.1 Ã 0.7 mm
⢠Excellent output linearity of illuminance
TOSHIBA
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Weight: 0.0054 g (typ.)
⢠Little fluctuation in light current and high level of sensitivity
: IL = 37 µA to 74 µA @EV = 100 lx using fluorescent light
: Light current variation width: Ã1.67 (when light current classification is specified.)
: Little temperature fluctuation
⢠Built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources
: IL (using incandescent light)/IL (using fluorescent light) = 1.2 (typ.)
⢠Low supply voltage, making device suitable for battery-powered equipment: VCC = 2.2 V to 5.5 V
Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Supply voltage
Output voltage
Stand-by voltage
Light current
Permissible power dissipation
Operating temperature range
Storage temperature range
Soldering temperature range (Note 1)
VCC
VOUT
Vstb
IL
P
Topr
Tstg
Tsol
â0.5 to 7
V
<= VCC
V
<= VCC
V
5
mA
35
mW
â30 to 85
°C
â40 to 100
°C
260
°C
Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling
Precautions.
1
2005-07-21
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