TPS841 Datasheet, PDF (1/6 Pages) Toshiba Semiconductor – Silicon Epitaxial Planar

TPS841(F),TPS843(F)
TOSHIBA Photo-IC Silicon Epitaxial Planar
TPS841(F),TPS843(F)
Lead(Pb)-Free
Photoelectric Switches
Copiers, Printers, and Facsimiles
Vending Machines
Handy Terminals
Unit: mm
The TPS841(F) and TPS843(F) represent a Si photo
IC of digital output type that integrates a photodiode,
amplifier circuit, and Schmitt trigger circuit into a
single chip.
These devices are low voltage drive types, and they
allow construction of low voltage systems which thus
consume less power.
These devices respond faster than the
phototransistor type. They output a high when light is
input.
• Compact side-view epoxy resin package
• Operates over a wide supply voltage range
: VCC = 2.7 to 15 V
• High speed response
: t_pLH = 9 μs, t_pHL = 15 μs (max)
• High sensitivity: 0.3 mW/cm² (max)
• Can be directly connected to TTL and CMOS.
• Digital output: TPS841(F) …. open collector
TPS843(F) …. with a pull-up resistor
TOSHIBA
Weight: 0.12 g (typ.)
0-3H1
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Supply voltage
Output voltage
TPS841(F)
TPS843(F)
Output current
Output current derating (Ta > 25°C)
Power dissipation
V_CC
V_O
I_O
ΔI_O/°C
P
15
15
=V_CC
16
−0.213
250
V
V
mA
mA/°C
mW
Power dissipation derating
(Ta > 25°C)
ΔP/°C
−3.33
mW/°C
Operating temperature range
T_opr
Storage temperature range
T_stg
Soldering temperature (5s) (Note 1)
T_sol
−30 to 95
°C
−40 to 100
°C
260
°C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: At the location of 1.3 mm from the resin package bottom.
1
2007-10-01