TLRME20CP Datasheet, PDF (1/3 Pages) Toshiba Semiconductor – Panel Circuit Indicator

Panel Circuit Indicator
TOSHIBA LED Lamp
TLRME20CP(F)
TLRME20CP(F)
Unit: mm
• Lead(Pb)-free products (lead: Sn-Ag-Cu)
• 5mm package
• InGaAℓP technology
• All plastic mold type
• Colored clear lens
• High intensity light emission
• Excellent low current light output
• Applications:
outdoor message signboards, safety equipment, automotive use, etc
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Product Name
TLRME20CP(F)
Color
Red
Material
InGaAlP
JEDEC
―
JEITA
―
TOSHIBA
4-6J1
Absolute Maximum Ratings (Ta = 25°C)
Weight: 0.31 g(Typ.)
Product Name
TLRME20CP(F)
Forward Current
I_F (mA)
50
Reverse Voltage
V_R (V)
4
Power Dissipation
P_D (mW)
120
Operating
Temperature
T_opr (°C)
−40~100
Storage
Temperature
T_stg (°C)
−40~120
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical and Optical Characteristics (Ta = 25°C)
Product Name
Typ. Emission Wavelength
λ_d
λ_P
Δλ
I_F
Luminous Intensity
I_V
Min Typ.
I_F
Forward Voltage
V_F
Typ. Max
I_F
Reverse Current
I_R
Max
V_R
TLRME20CP(F)
626 (636) 23
20 4760 12000 20
1.9
2.4
20
50
4
Unit
nm
mA
mcd
mA
V
mA
μA
V
(Note):Lamps are classified into the following ranks according to their luminous intensity, and packed in boxes by
each rank. V: 4760−12900 mcd, W: 8500−23000 mcd, X: 15300 mcd−
Precautions
Please be careful of the following:
• Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 1.6 mm from the body of the device)
• If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress
to the resin. Soldering should be performed after lead forming.
• This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.
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2007-10-01