TLP830_07 Datasheet, PDF (1/9 Pages) Toshiba Semiconductor – Infrared LED + Phototransistor

TOSHIBA Photointerrupter Infrared LED + Phototransistor
TLP830(F)
Lead(Pb)-Free
Track "00" Sensor For Floppy Disk Drive
Detection Of Sub−Scanning Quantity By
Image Scanner
Various Position Detection Sensor
TLP830(F)
TLP830(F) is a photointerrupter which uses a
high−radiant power GaAs LED and a fast−response
Si phototransistor. The device is high resolution
with a narrow slit pitch.
• Small package: 7.4mm (H), 4.5mm (D)
• Printed wiring board direct mounting type
(with a locating pin).
• Board thickness: 1mm or less
• Short lead type enabling automated mounting
• Gap: 2mm
• High resolution: Slit width 0.15mm
• High current transfer ratio: I_C/I_F = 3% (min)
• Material of the package
: Polybutylene terephthalate
(UL94V−0, black color)
• Detector side is of visible light cut type.
TOSHIBA
Weight: 0.4 g (typ.)
11−11C1
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Forward current
Forward current ^{Ta > 25°C}
LED ^derating
Ta > 85°C
Reverse voltage
Collector−emitter voltage
Emitter−collector voltage
Detector ^{Collector power dissipation}
Collector power dissipation
derating (Ta > 25°C)
Collector current
Operating temperature range
Storage temperature range
Soldering temperature (5 s)
Symbol
I_F
ΔI_F / °C
V_R
V_CEO
V_ECO
P_C
ΔP_C / °C
I_C
T_opr
T_stg
T_sol
Rating
50
−0.33
−2
5
35
5
75
−1
50
−30~85
−40~100
260
Unit
mA
mA / °C
V
V
V
mW
mW / °C
mA
°C
°C
°C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
1
2007-10-01