TLP719 Datasheet, PDF (1/5 Pages) Toshiba Semiconductor – TOSHIBA PHOTOCOUPLER GaAlAs IRED + PHOTO- IC

TOSHIBA PHOTOCOUPLER GaAl As IRED + PHOTO- IC
Preliminary
TLP719
DIGITAL LOGIC GROUND ISOLATION.
LINE RECEIVER.
MICROPROCESSOR SYSTEM INTERFACES.
4.58
SWITCHING POWER SUPPLY FEEDBACK CONTROL.
TRANSISTOR INVERTOR.
TLP719
Unit in mm
The TOSHIBA TLP719 consists of a GaAlAs high-output light
emitting diode and a high speed detector.
This unit is 6-lead SDIP. TLP719 is 50% smaller than 8PIN DIP
and has suited the safety standard reinforced insulation class.
So mounting area in safety standard required equipment can be reduced.
TLP719 has a Faraday shield integrated on the photodetector chip provides
an effective common mode noise transient immunity.
So this is suitable for application in noisy environmental condition.
1.27
0.4
TOSHIBA
Weight: ---g
7.62 0.25
1.25
9.7 0.3
• Open Collector
• Package Type : SDIP6
• Isolation voltage : 5000 Vrms (Min.)
• Common mode Transient Immunity
: ±10kV/us(Min.) @VCM=400V
• Switching speed : t_pHL = 0.8µs , t_pLH = 0.8µs (Max.)
@ I_F = 16mA ,V_CC = 5V,
R_L = 1.9kO ,Ta = 25°C
• TTL Compatible
• Construction Mechanical Rating
PIN CONFIGURATION (Top view)
1
2
3
SHIELD
6 ^1:ANODE
2:N.C.
5
3:CATHODE
4:EMITTER(GND)
5:COLLECTOR(OUTPUT)
4 _6:VCC
7.62 mm pich
standard type
10.16 mm pich
TLPXXXF type
Creepage Distance
Clearance
Insulation Thickness
7.0 mm (Min)
7.0 mm (Min)
0.4 mm (Min)
8.0 mm (Min)
8.0 mm (Min)
0.4 mm (Min)
SCHEMATIC
IF
1
VF
ICC
IO
VCC
6
VO
5
3
SHIELD
GND
4
A 0.1µF bypass capacitor must be
connected between pins 4 and 6.
1
2003-09-5