TLP718_15 Datasheet, PDF (1/9 Pages) Toshiba Semiconductor – Isolated Bus Drivers High Speed Line Receivers Microprocessor System Interfaces

TOSHIBA PHOTOCOUPLER GaAℓAs IRED & PHOTO-IC
TLP718
Isolated Bus Drivers
High Speed Line Receivers
Microprocessor System Interfaces
4.58±0.25
654
TLP718
Unit: mm
The Toshiba TLP718 consists of a GaAℓAs light-emitting diode and an
integrated high-gain, high-speed photodetector. This unit is a 6-pin SDIP. The
TLP718 is 50% smaller than the 8-PIN DIP and meets the reinforced insulation
class requirements of international safety standards. Therefore the mounting
area can be reduced in equipment requiring safety standard certification.
The detector has a totem pole output stage to provide both source and sink
driving. The detector IC has an internal shield that provides a guaranteed
common-mode transient immunity of 10 kV/μs.
The TLP718 is inverter logic type. For buffer logic type, the TLP715 is in line-
up.
123
1.27±0.2
7.62±0.25
1.25±0.25
 Inverter logic type (totem pole output)
0.4±0.1
9.7±0.3
 Guaranteed performance over temperature : −40 to 100°C
 Power supply voltage : 4.5 to 20 V
 Input current: IFHL = 3 mA (max)
 Switching time ( tpHL / tpLH₎ : 250 ns (max)
 Common-mode transient immunity : ±10 kV/μs (min)
TOSHIBA
11-5J1
Weight: 0.26 g (typ.)
Pin Configuration (Top View)
11-5J1
 Isolation voltage : 5000 Vrms (min)
 UL recognized
1
UL1577, File No.E67349
 c-UL recognized
2
CSA Component Acceptance Service No. 5A, File No.E67349
 Option (D4) VDE approved : DIN EN60747-5-5
3
Note : When a EN60747-5-5 approved type is needed,
VCC ₆ ^{1: ANODE}
2: N.C.
5 ^{3: CATHODE}
4: GND
GND
SHIELD
4
5: VO (Output)
6: VCC
Please designate “Option(D4)”
Schematic
ICC
 Construction Mechanical Rating
7.62 mm pitch
standard type
Creepage Distance
Clearance
Insulation Thickness
7.0 mm (min)
7.0 mm (min)
0.4 mm (min)
10.16 mm pitch
TLPXXXF type
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
IF
1+
VF
3-
VCC
6 ^(Note)
Tr1
IO
VO
Tr2
5
Truth Table
Input LED Tr1 Tr2 Output
H
ON OFF ON
L
L OFF ON OFF H
SHIELD
GND
4
Note: 0.1 μF bypass capacitor must be connected
between pins 6 and 4.
Start of commercial production
2008/12
1
2015-10-13