TLOU248 Datasheet, PDF (1/3 Pages) Toshiba Semiconductor – Panel Circuit Indicator

TOSHIBA LED Lamp InGaAℓP Orange Light Emission
TLOU248(F)
Panel Circuit Indicator
• Lead(Pb)-free products (lead: Sn-Ag-Cu)
• InGaAℓP orange LED
• Elliptical lens: Colored transparent lens
• Wide radiation
• Low drive current, high intensity orange light emission
• Plastic molded colored transparent lens provides for high contrast of
on−off ratio.
• Fast response time, capable of pulse operation.
• Applications: Suitable for outdoor message signboard, full color panel,
backlight.
TLOU248(F)
Unit in mm
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Forward current
I_F
30
mA
Reverse voltage
Power dissipation
Operating temperature range
Storage temperature range
V_R
4
V
P_D
72
mW
T_opr
−30~85
°C
T_stg
−40~120
°C
JEDEC
JEITA
TOSHIBA
―
―
4-5AP1
Weight: 0.3 g(Typ.)
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical and Optical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Min Typ. Max Unit
Forward voltage
V_F
IF = 20 mA
―
2.0
2.4
V
Reverse current
I_R
V_R = 4 V
―
―
50
μA
Luminous intensity
I_V
IF = 20 mA
(Note) 85 300 ― mcd
Peak emission wavelength
λ_P
I_F = 20 mA
― (612) ―
nm
Spectral line half width
Δλ
I_F = 20 mA
―
15
―
nm
Dominant wavelength
λd
I_F = 20 mA
―
605
―
nm
Note: Lamps are classified into the following ranks according to their luminous intensity. Each packing box includes
single Luminous Intensity class.
N: 85-230mcd, P: 153-414mcd, Q: 272mcd-
Precaution
Please be careful of the followings
• Soldering temperature: 260°C max Soldering time: 3 s max
(Soldering portion of lead: below the lead stopper of the device)
• If the lead is formed, the lead should be formed up to below the lead stopper of the device without forming stress
to the resin. Soldering should be performed after lead forming.
• This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure
that it will not be affected by this IR light.
1
2007-10-01