TLGU50T Datasheet, PDF (1/4 Pages) Toshiba Semiconductor – Panel Circuit Indicators

TL(GU,PGU)50T(F)
TOSHIBA InGaAℓP LED
TLGU50T(F),TLPGU50T(F)
Panel Circuit Indicators
Unit: mm
• Lead(Pb)-free products (lead: Sn-Ag-Cu)
• 3mm package
• InGaAℓP technology
• All plastic mold type
• Transparent lens
• Line-up: 2 colors (green and pure green)
• High intensity light emission
• Excellent low current light output
• Applications: message boards, security devices and dashboard
displays
Lineup
Product Name
Color
Material
TLGU50T(F)
TLPGU50T(F)
Green
Pure Green
InGaAlP
JEDEC
JEITA
TOSHIBA
―
―
4-3E1A
Absolute Maximum Ratings (Ta = 25°C)
Weight: 0.14 g(Typ.)
Product Name
TLFGU50T(F)
TLPGU50T(F)
Forward Current
I_F (mA)
30
30
Reverse Voltage
V_R (V)
4
4
Power Dissipation
P_D (mW)
72
72
Operating
Temperature
T_opr (°C)
−40~100
Storage
Temperature
T_stg (°C)
−40~120
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical and Optical Characteristics (Ta = 25°C)
Product Name
TLGU50T(F)
Typ. Emission Wavelength
λ_d
λ_P
Δλ
I_F
571 (574) 17
20
Luminous Intensity
I_V
Min Typ.
I_F
476 1200 20
TLPGU50T(F) 558 (562) 14
20
153 450
20
Unit
nm
mA
mcd
mA
Forward Voltage
V_F
Typ. Max
I_F
2.1
2.4
20
2.1
2.4
20
V
mA
Reverse Current
I_R
Max
V_R
50
4
50
4
μA
V
Precautions
Please be careful of the following:
• Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 1.6 mm from the body of the device)
• If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress
to the resin. Soldering should be performed after lead forming.
• This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.
1
2007-10-01