TLFGE50C Datasheet, PDF (1/3 Pages) Toshiba Semiconductor – Panel Circuit Indicator

TOSHIBA InGaAℓP LED
TLFGE50C(F)
TLFGE50C(F)
○ Panel Circuit Indicator
Unit: mm
• Lead(Pb)-free products (lead: Sn-Ag-Cu)
• 3mm package wide viewing angle
• InGaAℓP
• Emitted color: Fresh Green
• Colored, Transparent lens
• Applications: Various types of information panels, indicators for
amusement equipment and panel backlighting
illumination sources.
Absolute Maximum Ratings (Ta = 25°C)
CHARACTERISTICS
SYMBOL
RATING
UNIT
FORWARD CURRENT
I_F
50
mA
REVERSE VOLTAGE
V_R
4
V
POWER DISSIPATION
P_D
120
mW
OPERATING TEMPERATURE
T_opr
−40~100
°C
JEDEC
-
STORAGE TEMPERATURE
T_stg
−40~120
°C
EIAJ
-
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
TOSHIBA
4−3E1A
temperature, etc.) may cause this product to decrease in the
Weight: 0.14 g(Typ.)
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical and Optical Characteristics (Ta = 25°C)
CHARACTERISTICS
SYMBOL
TEST CONDITION
MIN TYP MAX UNIT
FORWARD VOLTAGE
V_F
I_F=20mA
⎯
2.0 2.4
V
REVERSE CURRENT
I_R
V_R=4V
⎯
⎯
50
μA
LUMINOUS INTENSITY
I_V
I_F=20mA(Note)
272 1000 ⎯ mcd
PEAK WAVELENGTH
λ_P
I_F=20mA
⎯ (568) ⎯
nm
SPECTRAL LINE HALF WIDTH
Δλ
I_F=20mA
⎯
15
⎯
nm
DOMINANT WAVELENGTH
λ_d
I_F=20mA
⎯
565
⎯
nm
Note:Lamps are classified into the following ranks according to their luminous intensity. Each packing box includes
single Luminous Intensity class.
Q:272-736mcd, R:476-1290mcd, S:850mcd-
Precautions
Please be careful of the following:
• Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 1.6 mm from the body of the device)
• If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress
to the resin. Soldering should be performed after lead forming.
• This visible LED lamp also emits some IR light.
If a photo detector is located near the LED lamp, please ensure that it will not be affected by this IR light.
1
2007-10-01