TIM5964-60SL Datasheet, PDF (1/4 Pages) Toshiba Semiconductor – MICROWAVE POWER GaAs FET

MICROWAVE SEMICONDUCTOR
TECHNICAL DATA
MICROWAVE POWER GaAs FET
TIM5964-60SL
FEATURES
T LOW INTERMODULATION DISTORTION
IM3=-45 dBc at Pout= 36.5dBm
Single Carrier Level
T HIGH POWER
P1dB=48.0dBm at 5.9GHz to 6.4GHz
T HIGH GAIN
G1dB=8.5dB at 5.9GHz to 6.4GHz
T BROAD BAND INTERNALLY MATCHED FET
T HERMETICALLY SEALED PACKAGE
RF PERFORMANCE SPECIFICATIONS ( Ta= 25_°C )
CHARACTERISTICS SYMBOL CONDITIONS
Output Power at 1dB Gain P1dB
Compression Point
Power Gain at 1dB Gain
G1dB
VDS=10V
Compression Point
f = 5.9 to 6.4GHz
Drain Current
IDS1
IDSset=9.5A
Gain Flatness
Power Added Efficiency
∆G
ηadd
3rd Order Intermodulation
IM3
Two-Tone Test
Distortion
Po=36.5dBm
Drain Current
IDS2
(Single Carrier Level)
Channel Temperature Rise ∆Tch VDS X IDS X Rth(c-c)
Recommended Gate Resistance(Rg) : 28 Ω (Max.)
UNIT
dBm
dB
A
dB
%
dBc
A
°^C
MIN.
47.0
7.5



-42


TYP. MAX.
48.0 
8.5 
13.2 15.0
 ±0.8
41 
-45 
 11.8
 100
ELECTRICAL CHARACTERISTICS ( Ta= 25_°C )
CHARACTERISTICS
Transconductance
Pinch-off Voltage
Saturated Drain Current
Gate-Source Breakdown
Voltage
Thermal Resistance
SYMBOL
gm
VGSoff
IDSS
VGSO
CONDITIONS
VDS= 3V
IDS= 12.0A
VDS= 3V
IDS= 200mA
VDS= 3V
VGS= 0V
IGS= -1.0mA
Rth(c-c) Channel to Case
UNIT MIN. TYP. MAX.
S
 20 
V -1.0 -1.8 -3.0
A
 38 
V
-5  
°^C/W  0.6 0.8
‹ The information contained herein is presented only as a guide for the applications of our products. No responsibility is
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA
before proceeding with design of equipment incorporating this product.
Rev. Aug. 2003