TIM5964-35SLA Datasheet, PDF (1/4 Pages) Toshiba Semiconductor – MICROWAVE POWER GaAs FET

MICROWAVE SEMICONDUCTOR
TECHNICAL DATA
MICROWAVE POWER GaAs FET
TIM5964-35SLA
FEATURES
„ LOW INTERMODULATION DISTORTION
IM3=-45 dBc at Po= 35.0dBm,
Single Carrier Level
„ HIGH POWER
P1dB=45.5dBm at 5.9GHz to 6.4GHz
„ HIGH GAIN
G1dB=9.0dB at 5.9GHz to 6.4GHz
„ BROAD BAND INTERNALLY MATCHED FET
„ HERMETICALLY SEALED PACKAGE
RF PERFORMANCE SPECIFICATIONS ( Ta= 25_°C )
CHARACTERISTICS SYMBOL CONDITIONS
Output Power at 1dB Gain P1dB
Compression Point
Power Gain at 1dB Gain
Compression Point
Drain Current
G1dB
IDS1
VDS=10V
f = 5.9 to 6.4GHz
Gain Flatness
ΔG
Power Added Efficiency
ηadd
3rd Order Intermodulation IM3
Two-Tone Test
Distortion
Po=35.0dBm
Drain Current
IDS2
(Single Carrier Level)
Channel Temperature Rise ΔTch
(VDS X IDS + Pin – P1dB)
X Rth(c-c)
Recommended gate resistance(Rg) : Rg= 28 Ω(MAX.)
UNIT MIN. TYP. MAX.
dBm 45.0 45.5 ⎯
dB 8.0 9.0 ⎯
A
⎯ 8.0 9.0
dB ⎯ ⎯ ±0.8
%
⎯ 39 ⎯
dBc -42 -45 ⎯
A
⎯ 8.0 9.0
°^C ⎯ ⎯ 100
ELECTRICAL CHARACTERISTICS ( Ta= 25_°C )
CHARACTERISTICS
Transconductance
Pinch-off Voltage
Saturated Drain Current
Gate-Source Breakdown
Voltage
Thermal Resistance
SYMBOL CONDITIONS
gm VDS= 3V
IDS= 10.5A
VGSoff VDS= 3V
IDS= 140mA
IDSS VDS= 3V
VGS= 0V
VGSO IGS= -420μA
Rth(c-c) Channel to Case
UNIT MIN. TYP. MAX.
mS ⎯ 6500 ⎯
V -1.0 -2.5 -4.0
A
⎯ 20 ⎯
V
-5 ⎯ ⎯
°^C/W ⎯ 1.0 1.3
‹ The information contained herein is presented only as a guide for the applications of our products. No responsibility is
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use,
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA
before proceeding with design of equipment incorporating this product.
Rev. Oct. 2006