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TD62S050AFM Datasheet, PDF (1/5 Pages) Toshiba Semiconductor – TD62S050AFM
TD62S050AFM
Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Collector-emitter voltage
Output withstand voltage
Output current
Input voltage
VCEO
50
V
VCE (SUS)
50
V
IOUT
500
mA
VIN
-0.5~30
V
Clamp diode reverse voltage
Clamp diode forward current
Power dissipation
VR
50
V
IF
500
mA
PD (Note 4)
0.78
W
Saturated thermal resistance
Rth (j-a)
(Note 4)
160
Rth (j-c)
(Note 5)
25
°C/W
Operating temperature
Storage temperature
Topr
-40~85
°C
Tstg
-55~150
°C
Note 4: 114.3 ´ 76.2 ´ 1.6 mm glass epoxy film substrate Cu heat dissipation pattern 100 mm2
Note 5: When an infinite heat sink is mounted.
Recommended Operating Condition (Ta = -40~85°C)
Characteristics
Output withstand voltage
Output current
Input voltage
Input voltage
Output ON
Output OFF
Clamp diode reverse voltage
Clamp diode forward current
Symbol
Test Condition
VCEO
IOUT
VIN
VIN (ON)
VIN (OFF)
VR
IF
¾
Ta = 60°C, Tj = 105°C
¾
IOUT = 400 mA, hFE = 800
¾
¾
¾
Min Typ. Max Unit
0
¾
50
V
¾
¾ 220 mA
0
¾
24
V
2.8
¾
24
V
0
¾
0.7
¾
¾
50
V
¾
¾ 350 mA
Electrical Characteristics (Ta = 25°C)
Characteristics
Output leakage current
Output saturation voltage
DC current amplification ratio
Input current
Output ON
Input voltage
Output ON
Output ON
Clamp diode leakage current
Clamp diode forward voltage
Turn-on delay
Turn-off delay
Symbol
Test
Circuit
Test Condition
Min Typ. Max Unit
ICEX
1 VCE = 50 V, VIN = OPEN
¾
¾
10
mA
VCE (sat)
IOUT = 300 mA, IIN = 500 mA
2
IOUT = 200 mA, IIN = 350 mA
¾
1.1
1.3
V
¾
1.0
1.2
hFE
2 VCE = 2.0 V, IOUT = 350 mA
1000 ¾
¾
IIN (ON)
3 VIN = 2.4 V, IOUT = 350 mA
¾
0.4 0.7 mA
VIN (ON)
4
VCE = 2 V,
hFE = 800
IOUT = 350 mA ¾
IOUT = 200 mA ¾
¾
2.6
¾
2.2
V
IR
5 VR = 50 V
¾
¾
10
mA
VF
6 IF = 350 mA
¾
1.6 2.0
V
tON
tOFF
7
VOUT = 50 V, RL = 125 W,
CL = 15 pF
¾ 0.02 ¾
ms
¾
1.0
¾
2
2001-12-05