TC74AC367P_07 Datasheet, PDF (1/9 Pages) Toshiba Semiconductor – CMOS Digital Integrated Circuit Silicon Monolithic Hex Bus Buffer (3-state)

TC74AC367P/F/FN/FT
TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic
TC74AC367P,TC74AC367F,TC74AC367FN,TC74AC367FT
Hex Bus Buffer (3-state)
The TC74AC367 is an advanced high speed CMOS HEX BUS
BUFFERs fabricated with silicon gate and double-layer metal
wiring C²MOS technology.
It achieves the high speed operation similar to equivalent
Bipolar Schottky TTL while maintaining the CMOS low power
dissipation.
It contains six buffers; four buffers are controlled by an enable
input ( G1 ), and the other two buffers are controlled by another
enable input ( G2 ). The outputs of each buffer group are enabled
when G1 and/or G2 inputs are held low; if held high, these
outputs are in a high impedance state.
All inputs are equipped with protection circuits against static
discharge or transient excess voltage.
Features
• High speed: t_pd = 3.7 ns (typ.) at V_CC = 5 V
• Low power dissipation: I_CC = 8 μA (max) at Ta = 25°C
• High noise immunity: V_NIH = V_NIL = 28% V_CC (min)
• Symmetrical output impedance: |I_OH| = I_OL = 24 mA (min)
Capability of driving 50 Ω
transmission lines.
• Balanced propagation delays: t_pLH ^∼− t_pHL
• Wide operating voltage range: V_{CC (opr)} = 2 to 5.5 V
• Pin and function compatible with 74F367
Note: xxxFN (JEDEC SOP) is not available in
Japan.
TC74AC367P
TC74AC367F
TC74AC367FN
TC74AC367FT
Weight
DIP16-P-300-2.54A
SOP16-P-300-1.27A
SOL16-P-150-1.27
TSSOP16-P-0044-0.65A
: 1.00 g (typ.)
: 0.18 g (typ.)
: 0.13 g (typ.)
: 0.06 g (typ.)
1
2007-10-01