SSM6L13TU Datasheet, PDF (1/8 Pages) Toshiba Semiconductor – Power Management Switch Applications

SSM6L13TU
TOSHIBA Field-Effect Transistor Silicon P / N Channel MOS Type
SSM6L13TU
Power Management Switch Applications
High-Speed Switching Applications
• 1.8 V drive
• P–ch , N–ch 2–in–1
• Low ON–resistance: Pch
•
•
: Nch
•
R_on = 460 mΩ (max) (@V_GS = −1.8 V)
R_on = 306 mΩ (max) (@V_GS = −2.5 V)
R_on = 235 mΩ (max) (@V_GS = 1.8 V)
R_on = 178 mΩ (max) (@V_GS = 2.5 V)
Q1 Absolute Maximum Ratings (Ta = 25 °C)
Characteristic
Symbol
Rating
Unit
Drain-source voltage
V_DS
20
V
Gate-source voltage
V_GSS
± 12
V
Drain current
DC
I_D
Pulse
I_DP
0.8
A
1.6
Q2 Absolute Maximum Ratings (Ta = 25 °C)
Characteristic
Symbol
Rating
Unit
Drain-source voltage
V_DS
−20
V
Gate-source voltage
V_GSS
±8
V
Drain current
DC
I_D
Pulse
I_DP
−0.8
A
−1.6
Absolute Maximum Ratings (Q1 , Q2 Common)
(Ta = 25 °C)
Unit: mm
2.1±0.1
1.7±0.1
1
6
2
5
3
4
1.Source1
2.Gate1
UF6 ^3.Drain2
4.Source2
5.Gate2
6.Drain1
JEDEC
―
JEITA
―
TOSHIBA
2-2T1B
Weight: 7 mg (typ.)
Characteristic
Symbol
Rating
Unit
Drain power dissipation
P_{D (Note 1)}
500
mW
Channel temperature
T_ch
150
°C
Storage temperature range
T_stg
−55 to 150
°C
Note:
Note 1:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Mounted on an FR4 board (total dissipation)
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm² )
Marking
Equivalent Circuit (top view)
654
6
5
4
KV
Q1
Q2
123
1
2
3
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that
come into direct contact with devices should be made of antistatic materials.
1
2007-11-01