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SSM6J21TU Datasheet, PDF (1/6 Pages) Toshiba Semiconductor – High Current Switching Applications
SSM6J21TU
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOSⅢ)
SSM6J21TU
High Current Switching Applications
• Suitable for high-density mounting due to compact package
• Low on resistance: Ron = 88 mΩ (max) (@VGS = -2.5 V)
Unit: mm
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Drain-Source voltage
VDS
-12
V
Gate-Source voltage
VGSS
±12
V
Drain current
DC
ID
Pulse
IDP
-3
A
-6
1,2,5,6 : Drain
3
: Gate
4
: Source
Drain power dissipation
PD
500
mW
(Note 1)
Channel temperature
Tch
150
°C
Storage temperature range
Tstg
−55~150
°C
JEDEC
-
Note:
Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
JEITA
TOSHIBA
-
2-2T1D
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
Weight: 7 mg (typ.)
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Mounted on FR4 board.
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 645 mm2 )
Marking
654
Equivalent Circuit
654
KPA
123
123
Handling Precaution
When handling individual devices (which are not yet mounting on a circuit board), be sure that the environment
is protected against electrostatic discharge. Operators should wear anti-static clothing and use containers and
other objects that are made of anti-static materials.
1
2007-11-01