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SSM3K15F_07 Datasheet, PDF (1/5 Pages) Toshiba Semiconductor – High Speed Switching Applications
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type
SSM3K15F
SSM3K15F
High Speed Switching Applications
Analog Switch Applications
• Small package
• Low on resistance
: Ron = 4.0 Ω (max) (@VGS = 4 V)
: Ron = 7.0 Ω (max) (@VGS = 2.5 V)
Unit: mm
+0.5
2.5-0.3
+0.25
1.5-0.15
1
2
3
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Drain-source voltage
VDS
30
V
Gate-source voltage
Drain current
DC
Pulse
VGSS
ID
IDP
±20
V
100
mA
200
S-MINI
1.Gate
2.Source
3.Drain
Drain power dissipation (Ta = 25°C)
PD
Channel temperature
Tch
Storage temperature
Tstg
200
mW
150
°C
−55~150
°C
JEDEC
JEITA
TO-236MOD
SC-59
Note:
Using continuously under heavy loads (e.g. the application of
TOSHIBA
2-3F1F
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
Weight: 0.012 g (typ.)
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are
within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Marking
Equivalent Circuit
3
3
DP
1
2
1
2
Handling Precaution
When handling individual devices (which are not yet mounting on a circuit board), be sure that the environment
is protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other
objects that come into direct contact with devices should be made of anti-static materials.
1
2007-11-01