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SSM3K122TU_14 Datasheet, PDF (1/6 Pages) Toshiba Semiconductor – TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type | |||
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SSM3K122TU
TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type
SSM3K122TU
Power Management Switch Applications
High-Speed Switching Applications
⢠1.5 V drive
⢠Low ON-resistance:
Ron = 304 m⦠(max) (@VGS = 1.5 V)
Ron = 211 m⦠(max) (@VGS = 1.8 V)
Ron = 161 m⦠(max) (@VGS = 2.5 V)
Ron = 123 m⦠(max) (@VGS = 4.0 V)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Drain-Source voltage
Gate-Source voltage
Drain current
DC
Pulse
Drain power dissipation
Channel temperature
Storage temperature range
Symbol
VDSS
VGSS
ID
IDP
PD (Note 1)
PD (Note 2)
Tch
Tstg
Rating
20
± 10
2.0
4.0
800
500
150
â55 to 150
Unit
V
V
A
mW
°C
°C
Note:
Note 1:
Note 2:
Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba
Semiconductor Reliability Handbook (âHandling Precautionsâ/
âDerating Concept and Methodsâ) and individual reliability data (i.e.
reliability test report and estimated failure rate, etc).
Mounted on a ceramic board.
(25.4 mm à 25.4 mm à 0.8 t, Cu Pad: 645 mm2 )
Mounted on a FR4 board.
(25.4 mm à 25.4 mm à 1.6 t, Cu Pad: 645 mm2 )
Electrical Characteristics (Ta = 25°C)
2.1±0.1
1.7±0.1
Unit: mm
1
2
3
UFM
1: Gate
2: Source
3: Drain
JEDEC
â
JEITA
â
TOSHIBA
2-2U1A
Weight: 6.6 mg (typ.)
Characteristics
Drain-Source breakdown voltage
Drain cutoff current
Gate leakage current
Gate threshold voltage
Forward transfer admittance
Drain-Source ON-resistance
Input capacitance
Output capacitance
Reverse transfer capacitance
Total Gate Charge
GateâSource Charge
GateâDrain Charge
Switching time
Turn-on time
Turn-off time
Drain-Source forward voltage
Note 3: Pulse test
Symbol
Test Condition
Min Typ. Max Unit
V (BR) DSS ID = 1 mA, VGS = 0 V
V (BR) DSX ID = 1 mA, VGS = â 10 V
20
â¯
â¯
V
12
â¯
â¯
IDSS
VDS = 20 V, VGS = 0 V
â¯
â¯
1
μA
IGSS
VGS = ± 10 V, VDS = 0 V
â¯
â¯
±1
μA
Vth
VDS = 3 V, ID = 1 mA
0.35 â¯
1.0
V
âYfsâ
VDS = 3 V, ID = 1.0 A
(Note 3) 2.6
5.2
â¯
S
ID = 1.0 A, VGS = 4.0 V
(Note 3)
â¯
87
123
RDS (ON)
ID = 1.0 A, VGS = 2.5 V
ID = 0.5 A, VGS = 1.8 V
(Note 3)
â¯
112
161
mΩ
(Note 3)
â¯
147 211
ID = 0.3 A, VGS = 1.5 V
(Note 3)
â¯
182 304
Ciss
â¯
195
â¯
Coss
VDS = 10 V, VGS = 0 V, f = 1 MHz
â¯
35
â¯
pF
Crss
â¯
29
â¯
Qg
â¯
3.4
â¯
Qgs
VDS = 10 V, ID= 2.0 A, VGS = 4 V
â¯
2.3
â¯
nC
Qgd
â¯
1.1
â¯
ton
VDD = 10 V, ID = 0.5 A,
toff
VGS = 0 to 2.5 V, RG = 4.7 Ω
â¯
8.0
â¯
ns
â¯
9.0
â¯
VDSF
ID = â2.0 A, VGS = 0 V
(Note 3) ⯠â0.85 -1.2
V
Start of commercial production
2007-10
1
2014-03-01
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