|
HN2S03FU Datasheet, PDF (1/3 Pages) Toshiba Semiconductor – High Speed Switching Application | |||
|
TOSHIBA Diode Silicon Epitaxial Schottky Barrier Type
HN2S03FU
HN2S03FU
High Speed Switching Application
Unit: mm
z HN2S03FU is composed of 3 independent diodes.
z Low forward voltage
: VF (3) = 0.50V (typ.)
z Low reverse current
: IR= 0.5μA (max)
z Small total capacitance : CT = 3.9pF (typ.)
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Maximum (peak) reverse Voltage
VRM
25
V
Reverse voltage
VR
20
V
Maximum (peak) forward current
IFM
100 *
mA
Average forward current
IO
50 *
mA
Surge current (10ms)
IFSM
1*
A
Power dissipation
P
200 **
mW
Junction temperature
Tj
125
°C
JEDEC
â
Storage temperature range
Tstg
â55â¼125
°C
EIAJ
â
Operating temperature range
Topr
â40â¼110
°C
TOSHIBA
1-2T1C
Weight: 6.2mg(Typ.)
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(âHandling Precautionsâ/âDerating Concept and Methodsâ) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
* : This is absolute maximum rating of single diode (Q1 or Q2 or Q3).
In the case of using 2 or 3 diodes, the absolute maximum ratings
per diodes is 75 % of the single diode one.
** :Total rating
Electrical Characteristics (Q1, Q2, Q3 Common, Ta = 25°C)
Characteristic
Forward voltage
Reverse current
Total capacitance
Symbol
VF (1)
VF (2)
VF (3)
IR
CT
Test
Circuit
Test Condition
â IF = 1mA
â IF = 5mA
â IF = 50mA
â VR = 20V
â VR = 0, f = 1MHz
Min Typ. Max Unit
â 0.33 â
â 0.38 â
V
â 0.50 0.55
â
â
0.5 μA
â
3.9
â
pF
1
2007-11-01
|
▷ |