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DSF521CT Datasheet, PDF (1/4 Pages) Toshiba Semiconductor – High Speed Switching Application | |||
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TOSHIBA Diode Silicon Epitaxial Schottky Barrier Type
DSF521CT
DSF521CT
High Speed Switching Application
Low forward voltage : VF (3) = 0.5V (max)
Abusolute Maximum Ratings (Ta = 25°C)
0.6±0.05
Unit: mm
Characteristic
Symbol
Rating
Unit
Reverse voltage
Maximum (peak) forward current
Average forward current
Surge current (10ms)
Power dissipation
VR
IFM
IO
IFSM
P*
30
V
300
mA
200
mA
1
A
150
mW
0.38
+0.02
-0.03
0.5±0.03
0.05±0.03
Junction temperature
Tj
125
°C
Storage temperature range
Tstg
â55 to 125
°C
Operating temperature range
Topr
â40 to 100
°C
*: Mounted on a glass epoxy circuit board of 20 mm à 20 mm,
pad dimension of 4 mm à 4 mm.
CST2
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba
Semiconductor Reliability Handbook (âHandling
Precautionsâ/âDerating Concept and Methodsâ) and individual
reliability data (i.e. reliability test report and estimated failure rate,
etc).
JEDEC
â
JEITA
â
TOSHIBA
1-1P1A
Weight: 0.7 mg (typ.)
Electrical Characteristics (Ta = 25°C)
Characteristic
Forward voltage
Reverse current
Total capacitance
Symbol
VF (1)
VF (2)
VF (3)
IR (1)
IR (2)
CT
Test
Circuit
Test Condition
â IF = 1mA
â IF = 5mA
â IF = 200mA
â VR = 10V
â VR = 30V
â VR = 0, f = 1 MHz
Min Typ. Max Unit
â
0.2
â
â 0.24 â
V
â 0.45 0.5
â
â
20
μA
â
â
30
â¯
34
â¯
pF
Equivalent Circuit (top view)
Marking
8867
1
2009-06-26
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