DSF05S30U Datasheet, PDF (1/3 Pages) Toshiba Semiconductor – Diode Silicon Epitaxial Schottky Barrier Type

TOSHIBA Diode Silicon Epitaxial Schottky Barrier Type
DSF05S30U
DSF05S30U
High Speed Switching Application
Unit: mm
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Reverse voltage
Average forward current
Surge current (10ms)
Junction temperature
Storage temperature range
V_R
I_O
I_FSM
T_j
T_stg
30
V
500 ＊
mA
5
A
125
°C
−55 to 125
°C
*: Mounted on a glass-epoxy circuit board of 20 × 20 mm,
pad dimensions of 4 × 4 mm.
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
USC
reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ^JEDEC
―
ratings.
JEITA
―
Please design the appropriate reliability upon reviewing the Toshiba TOSHIBA
1-1E1A
Semiconductor Reliability Handbook (“Handling
Weight: 4.5 mg (typ.)
Precautions”/“Derating Concept and Methods”) and individual
reliability data (i.e. reliability test report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristic
Forward voltage
Reverse current
Total capacitance
Symbol
V_{F (1)}
V_{F (2)}
V_{F (3)}
I_R(1)
C_T
Test
Circuit
Test Condition
― I_F = 10mA
― I_F = 200mA
― I_F = 500mA
― V_R = 30V
― V_R = 0, f = 1 MHz
Min Typ. Max Unit
― 0.23 ―
― 0.35 ―
V
― 0.40 0.45
―
5.3
50
μA
⎯ 120 ⎯
pF
Marking
Equivalent Circuit (top view)
FP
Handling Precaution
Schottky barrier diodes have reverse current characteristic compared to the other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
1
2009-05-11