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DF10G6M4N Datasheet, PDF (1/8 Pages) Toshiba Semiconductor – This product is designed for protection against electrostatic discharge and is not intended for any other purpose, including, but not limited to, voltage regulation. | |||
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TOSHIBA Diodes for Protecting against ESD
DF10G6M4N
Application
- ESD Protection
Note: This product is designed for protection against electrostatic discharge
(ESD) and is not intended for any other purpose, including, but not limited to,
voltage regulation.
Absolute Maximum Ratings (Ta = 25°C)
DF10G6M4N
Characteristic
Symbol Rating
Unit
Electrostatic discharge voltage
IEC61000-4-2(Contact)
IEC61000-4-2(Air)
VESD
±23
kV
(Note 1)
Peak pulse power ( tp = 8 / 20 s )
PPK
30
W
Maximum peak pulse current ( tp = 8 / 20 s )
IPP
2
A
(Note 2)
Junction temperature
Tj
150
°C
Storage temperature range
Tstg
-55~150
°C
DFN10
1:I/O 6:NC
2:I/O 7:NC
3:GND 8:NC
4:I/O 9:NC
5:I/O 10:NC
Note1 : according to IEC61000-4-2
Note2 : according to IEC61000-4-5
JEDEC
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Note3:Using continuously under heavy loads (e.g. the application of high JEITA
ï¾ï
temperature/current/voltage and the significant change in temperature, TOSHIBA
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etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) Weight: 3.2mg (typ.)
are within the absolute maximum ratings.Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(âHandling Precautionsâ/ âDerating Concept and Methodsâ) and individual
reliability data (i.e. reliability test report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
VRWM : Working peak reverse voltage
VBR : Reverse breakdown voltage
IBR : Reverse breakdown current
IR : Reverse Current
VC : Clamping Voltage
IPP : Peak pulse current
RDYN : Dynamic resistance
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2015-09-29
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