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CUS551V30 Datasheet, PDF (1/5 Pages) Toshiba Semiconductor – High-Speed Switching | |||
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Schottky Barrier Diode Silicon Epitaxial
CUS551V30
1. Applications
⢠High-Speed Switching
2. Features
(1) Low forward voltage: VF(3) = 0.38 V (typ.)
(2) General-purpose USC package, equivalent to SOD-323 and SC-76 packages.
3. Packaging and Internal Circuit
CUS551V30
1: Cathode
2: Anode
USC
4. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25î)
Characteristics
Symbol Note
Rating
Unit
Reverse voltage
VR
î¥
30
V
Average rectified current
IO (Note 1)
500
mA
Non-repetitive peak forward surge current
IFSM (Note 2)
5
A
Junction temperature
Tj
î¥
125
î
Storage temperature
Tstg
î¥
-55 to 125
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Mounted on a glass-epoxy circuit board of 20 mm à 20 mm, pad dimensions of 4 mm à 4 mm
Note 2: Measured with a 10 ms pulse.
1
2012-06-12
Rev.4.0
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