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CUS04 Datasheet, PDF (1/5 Pages) Toshiba Semiconductor – Switching Mode Power Supply Applications | |||
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TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CUS04
Switching Mode Power Supply Applications
Portable Equipment Battery Application
CUS04
Unit: mm
⢠Forward voltage: VFM = 0.58 V@IF = 0.7 A
⢠Average forward current: IF (AV) = 0.7A
⢠Repetitive peak reverse voltage: VRRM = 60 V
⢠Suitable for compact assembly due to small surface-mount package
âUSâFLATTMâ (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
Average forward current
VRRM
IF (AV)
60
V
0.7
(Note 1)
A
Peak one cycle surge forward current
IFSM
20 (50 Hz)
A
Junction temperature
Storage temperature range
Tj
â40 to 150
°C
Tstg
â40 to 150
°C
Note 1: Ta = 27°C:
Device mounted on a glass-epoxy board
Board size: 50 mm à 50 mm,
Land size: 6 mm à 6 mm
Rectangular waveform (α = 180°), VR = 30 V
JEDEC
â
JEITA
TOSHIBA
3-2B1A
Weight: 0.004 g (typ.)
Note 2:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(âHandling Precautionsâ/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Junction capacitance
Thermal resistance
(junction to ambient)
Thermal resistance (junction to lead)
Symbol
Test Condition
Min
VFM (1) IFM = 0.1 A
â
VFM (2) IFM = 0.7 A
â
IRRM (1) VRRM = 5 V
â
IRRM (2) VRRM = 60 V
â
Cj
VR = 10 V, f = 1.0 MHz
â
Device mounted on a ceramic board
(board size: 50 mm à 50 mm)
(soldering land: 2 mm à 2 mm)
â
Rth (j-a)
(board thickness: 0.64 t)
Device mounted on a glass-epoxy board
(board size: 50 mm à 50 mm)
(soldering land: 6 mm à 6 mm)
â
(board thickness: 1.6 t)
Rth (j-â) Junction to lead of cathode side
â
Typ.
0.40
0.55
0.3
3.0
38
â
â
â
Max Unit
â
V
0.58
â
μA
100
â
pF
75
°C/W
150
30 °C/W
1
2006-11-13
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