CUS02_06 Datasheet, PDF (1/5 Pages) Toshiba Semiconductor – Switching Mode Power Supply Applications

TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CUS02
CUS02
Switching Mode Power Supply Applications
Portable Equipment Battery Application
Unit: mm
• Forward voltage: V_FM = 0.45 V@I_F = 0.7 A
• Average forward current: I_{F (AV)} = 1.0 A
• Repetitive peak reverse voltage: V_RRM = 30 V
• Suitable for compact assembly due to small surface-mount package
“US−FLAT^TM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
Average forward current
V_RRM
I_{F (AV)}
30
V
1.0
(Note 1)
A
Peak one cycle surge forward current
I_FSM
20 (50 Hz)
A
Junction temperature
T_j
−40 to 150
°C
Storage temperature range
T_stg
−40 to 150
°C
JEDEC
―
Note 1: Ta = 52°C:
Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm,
Land size: 6 mm × 6 mm
Rectangular waveform (α = 180°), V_R = 15 V
JEITA
TOSHIBA
3-2B1A
Weight: 0.004 g (typ.)
Note 2:
Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Junction capacitance
Thermal resistance
(junction to ambient)
Thermal resistance (junction to lead)
Symbol
V_{FM (1)}
V_{FM (2)}
V_{FM (3)}
I_{RRM (1)}
I_{RRM (2)}
C_j
R_{th (j-a)}
R_{th (j-I)}
Test Condition
I_FM = 0.1 A
I_FM = 0.7 A
I_FM = 1.0 A
V_RRM = 5 V
V_RRM = 30 V
V_R = 10 V, f = 1.0 MHz
Device mounted on a ceramic board
(soldering land: 2 mm × 2 mm)
Device mounted on a glass-epoxy
board
(soldering land: 6 mm × 6 mm)
Junction to lead of cathode side
Min Typ. Max Unit
― 0.35 ―
―
0.42 0.45
V
― 0.47 ―
―
0.7
―
μA
―
10 100
―
40
―
pF
―
―
75
°C/W
―
―
150
―
―
30 °C/W
1
2006-11-13