|
CRG09 Datasheet, PDF (1/6 Pages) Toshiba Semiconductor – General Purpose Rectifier Applications | |||
|
TOSHIBA Rectifier Silicon Diffused Type
CRG09
CRG09
General Purpose Rectifier Applications
⢠Repetitive peak reverse voltage: VRRM = 400 V
⢠Average forward current: IF (AV) = 1.0 A
⢠Forward voltage: VFM = 1.1 V (max) (@IFM = 0.7 A)
⢠High ESD Capability
⢠Suitable for high-density board assembly due to the use of a small
surface-mount package, SâFLATTM
Unit: mm
â¡
Absolute Maximum Ratings (Ta = 25°C)
0.9 ± 0.1
0.16
+ 0.2
â
1.6 â 0.1
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
Average forward current
VRRM
400
V
IF(AV)
1.0 (Note 1)
A
â ANODE
â¡ CATHODE
Non-repetitive peak surge current
IFSM
15 (50 Hz)
A
Junction temperature
Tj
â40 to 150
°C
Storage temperature
Tstg
â40 to 150
°C
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
JEDEC
JEITA
TOSHIBA
â
â
3-2A1A
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
Weight: 0.013 g (typ.)
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(âHandling Precautionsâ/âDerating Concept and Methodsâ) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Ta = 66°C
Device mounted on a ceramic board
Board size: 50 mm à 50 mm
Soldering size: 2 mm à 2 mm
Board thickness: 0.64 mm
1
2010-08-05
|
▷ |