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CRG04 Datasheet, PDF (1/4 Pages) Toshiba Semiconductor – General-Purpose Rectifier Applications | |||
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TOSHIBA Rectifier Silicon Diffused Type
CRG04
General-Purpose Rectifier Applications
⢠Repetitive peak reverse voltage: VRRM = 600 V
â¡
⢠Average forward current: IF (AV) = 1.0 A
⢠Average forward voltage: VFM = 1.1V(Max)
⢠Suitable for high-density board assembly due to the use of a small
surface-mount package, SâFLATTM
CRG04
Unit: mm
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
0.9 ± 0.1
0.16
+ 0.2
â
1.6 â 0.1
Repetitive Peak Reverse Voltage
VRRM
600
V
Average Forward Current
IF (AV)
1.0(Note1)
A
Peak One Cycle Surge Forward
Current (NonâRepetitive)
IFSM
15.0 (50Hz)
A
Junction Temperature
Tj
â40 to 150
°C
Storage Temperature Range
Tstg
â40 to 150
°C
Note 1: Ta=66°C
Device mounted on a ceramic board
board size: 50 mm à 50 mm
soldering land: 2 mm Ã2 mm
board thickness: 0.64 mm
Half-sine waveform: α =180°
â ANODE
â¡ CATHODE
JEDEC
â
JEITA
â
TOSHIBA
3-2A1A
Weight: 0.013 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(âHandling Precautionsâ/âDerating Concept and Methodsâ) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Thermal resistance
Symbol
VFM(1)
VFM(2)
VFM(3)
IRRM
Rth (j-a)
Rth (j-â)
Test Condition
IFM = 0.1 A (Pulse test)
IFM = 0.7 A (Pulse test)
IFM = 1.0 A (Pulse test)
VRRM = 600 V (Pulse test)
Device mounted on a ceramic board
Board size: 50 mm à 50 mm
Soldering land: 2 mm à 2 mm
Board thickness: 0.64 mm
Device mounted on a glass-epoxy board
Board size: 50 mm à 50 mm
Soldering land: 6 mm à 6 mm
Board thickness: 1.6 mm
â
Min Typ. Max Unit
⯠0.84 â¯
V
⯠0.95 â¯
V
⯠0.98 1.1
V
â¯
â¯
10
μA
â¯
â¯
65
°C/W
â¯
â¯
130
â¯
â¯
20 °C/W
1
2008-02-01
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