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CMS17 Datasheet, PDF (1/5 Pages) Toshiba Semiconductor – Switching Mode Power Supply Applications | |||
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TOSHIBA Schottky Barrier Diode
CMS17
CMS17
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
Unit: mm
⢠Forward voltage: VFM = 0.48 V (max)
⢠Average forward current: IF (AV) = 2.0 A
⢠Repetitive peak reverse voltage: VRRM = 30 V
⢠Suitable for compact assembly due to a small surface-mount package:
âMâFLATTMâ (Toshiba package name)â
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Repetitive peak reverse voltage
Average forward current
Nonrepetitive peak surge current
Junction temperature
Storage temperature range
VRRM
IF (AV)
IFSM
Tj
Tstg
30
V
2.0 (Note 1) A
30 (50 Hz)
A
â40~150
°C
â40~150
°C
Note 1:
Note 2:
Ta = 77°C
Device mounted on a ceramic board
Board size: 50 mm à 50 mm
Soldering size: 2 mm à 2 mm
JEDEC
â¯
JEITA
â¯
Board thickness: 0.64 t
Rectangular waveform (α = 180°), VR = 15 V
TOSHIBA
3-4E1A
Using continuously under heavy loads (e.g. the application of
Weight: 0.023 g (typ.)
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(âHandling Precautionsâ/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristic
Peak forward voltage
Peak repetitive reverse current
Junction capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to lead)
Symbol
Test Condition
Min Typ. Max Unit
VFM (1) IFM = 1.0 A (pulse test)
â¯
VFM (2) IFM = 2.0 A (pulse test)
â¯
IRRM (1) VRRM = 5 V (pulse test)
â¯
IRRM (2) VRRM = 30 V (pulse test)
â¯
Cj
VR = 10 V, f = 1.0 MHz
â¯
Device mounted on a ceramic board
(board size: 50 mm à 50 mm)
(soldering land: 2 mm à 2 mm)
â¯
(board thickness: 0.64 t)
Device mounted on a glass-epoxy board
Rth (j-a)
(board size: 50 mm à 50 mm)
(soldering land: 6 mm à 6 mm)
â¯
(board thickness: 1.6 t)
Device mounted on a glass-epoxy board
(board size: 50 mm à 50 mm)
(soldering land: 2.1 mm à 1.4 mm)
â¯
(board thickness: 1.6 t)
0.42 â¯
V
0.45 0.48
0.8
â¯
μA
10 100
90
â¯
pF
â¯
60
â¯
135 °C/W
â¯
210
Rth (j-â)
â¯
â¯
â¯
16 °C/W
1
2006-11-13
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