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CMS04_13 Datasheet, PDF (1/5 Pages) Toshiba Semiconductor – TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type | |||
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TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CMS04
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
⢠Forward voltage: VFM = 0.37 V (max)
⢠Average forward current: IF (AV) = 5.0 A
⢠Repetitive peak reverse voltage: VRRM = 30 V
⢠Suitable for compact assembly due to small surface-mount package
âMâFLATTMâ (Toshiba package name)
CMS04
Unit: mm
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
VRRM
30
V
Average forward current
IF (AV)
5.0 (Note 1) A
Peak one cycle surge forward current
(non-repetitive)
IFSM
70 (50 Hz)
A
Junction temperature
JEDEC
â
Tj
â40~125
°C
Storage temperature
Tstg
â40~150
°C
JEITA
â
Note 1: Tâ = 36°C: Rectangular waveform (α = 180°), VR = 15 V
Note 2: Using continuously under heavy loads (e.g. the application of
TOSHIBA
3-4E1A
Weight: 0.023 g (typ.)
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(âHandling Precautionsâ/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Junction capacitance
Thermal resistance
Symbol
VFM (1)
VFM (2)
VFM (3)
IRRM (1)
IRRM (2)
Cj
Rth (j-a)
Rth (j-â)
Test Condition
Min Typ. Max Unit
IFM = 1 A
â¯
IFM = 3 A
â¯
IFM = 5 A
â¯
VRRM = 5 V
â¯
VRRM = 30 V
â¯
VR = 10 V, f = 1.0 MHz
â¯
Device mounted on a ceramic board
(soldering land: 2 mm à 2 mm)
â¯
0.27 â¯
0.31 â¯
V
0.35 0.37
0.31 â¯
mA
3.3 8.0
330
â¯
pF
â¯
60
Device mounted on a glass-epoxy
board
â¯
â¯
135 °C/W
(soldering land: 6 mm à 6 mm)
â¯
â¯
â¯
16
Start of commercial production
2000-07
1
2013-11-01
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