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1SS424 Datasheet, PDF (1/3 Pages) Toshiba Semiconductor – High-Speed Switching Applications | |||
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TOSHIBA Diode Silicon Epitaxial Schottky Barrier Type
1SS424
High-Speed Switching Applications
z Low forward voltage
: VF (3) = 0.50 V (typ.)
1SS424
Unit: mm
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Maximum (peak) reverse voltage
Reverse voltage
Maximum (peak) forward current
VRM
VR
IFM
30
V
20
V
300
mA
Average forward current
IO
200
mA
Surge current (10 ms)
IFSM
1
A
Power dissipation
P*
150
mW
Junction temperature
Tj
125
°C
Storage temperature range
Tstg
â55~125
°C
Operating temperature range
Topr
â40~100
°C
JEDEC
â
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
JEITA
â
TOSHIBA
1-1G1A
Weight: 1.4 mg (typ.)
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are
within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(âHandling Precautionsâ/âDerating Concept and Methodsâ) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
*:
Mounted on a glass-epoxy circuit board of 20 Ã 20 mm,
pad dimensions of 4 Ã 4 mm.
Electrical Characteristics (Ta = 25°C)
Characteristic
Forward voltage
Reverse current
Total capacitance
Symbol
VF (1)
VF (2)
VF (3)
IR (1)
IR (2)
CT
Test
Circuit
Test Condition
â IF = 1 mA
â IF = 5 mA
â IF = 200 mA
â VR = 10 V
â VR = 20 V
â VR = 0, f = 1 MHz
Min Typ. Max Unit
â 0.18 â
â 0.23 â
V
â 0.42 0.5
â
â
30
μA
â
â
50
â
20
â
pF
Equivalent Circuit (Top View)
Marking
S8
1
2007-11-01
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