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1SS421 Datasheet, PDF (1/3 Pages) Toshiba Semiconductor – High-Speed Switching Application | |||
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TOSHIBA Diode Silicon Epitaxial Schottky Barrier Type
1SS421
1SS421
High-Speed Switching Application
Unit: mm
Low forward voltage: VF (3) = 0.50V (max)
Abusolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Reverse voltage
VR
30
V
Maximum (peak) forward current
IFM
300
mA
Average forward current
IO
200
mA
Surge current (10ms)
IFSM
1
A
Power dissipation
P*
150
mW
Junction temperature
Tj
125
°C
Storage temperature range
Tstg
â55 to 125
°C
Operating temperature range
Topr
â40 to 100
°C
*:
Mounted on a glass epoxy circuit board of 20 mm à 20 mm,
Cu pad dimension of 4 mm à 4 mm.
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba
Semiconductor Reliability Handbook (âHandling
Precautionsâ/âDerating Concept and Methodsâ) and individual
reliability data (i.e. reliability test report and estimated failure rate,
etc).
JEDEC
â
JEITA
â
TOSHIBA
1-1G1A
Weight: 1.4 mg (typ.)
Electrical Characteristics (Ta = 25°C)
Characteristics
Forward voltage
Reverse current
Total capacitance
Symbol
VF (1)
VF (2)
VF (3)
IR (1)
IR (2)
CT
Test
Circuit
Test Condition
â IF = 1 mA
â IF = 5 mA
â IF = 200 mA
â VR = 10 V
â VR = 30 V
â VR = 0, f = 1 MHz
Min Typ. Max Unit
â 0.18 â
â 0.22 â
V
â 0.44 0.5
â
â
20
μA
â
â
30
â¯
19
â¯
pF
Equivalent Circuit (top view)
Marking
S7
1
2008-02-02
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