XBP06V4E4GR-12 Datasheet, PDF (3/4 Pages) Torex Semiconductor – Transient Voltage Suppressor

■PACKAGING INFORMATION
● USP-4 Power Dissipation
Power dissipation data for the USP-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described
condition.
1. Measurement Condition (Reference data)
Condition:
Mount on a board
Ambient:
Natural convection
Soldering:
Board:
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the board area
in top and back faces.
Package heat-sink is tied to the copper traces.
Material:
Glass Epoxy (FR-4)
Thickness:
1.6 mm
Through-hole:
4 x 0.8 Diameter
XBP06V4E4GR-G
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 150℃)
Ambient Temperature (℃)
25
150
Power Dissipation Pd (mW)
1000
0
Thermal Resistance (℃/W)
125.00
1200
1000
800
600
400
200
0
25
Pd-TPad特vs性. Tグa ラフ
50
75
100
125
150
Ambi_周ent_囲Te_温mp_度er_Tat_au_（re_℃: T_）a (℃)
3/4